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Power chips are linked to outside circuits with packaging, and their performance depends upon the assistance of the packaging. In high-power circumstances, power chips are generally packaged as power components. Chip interconnection describes the electric link on the top surface of the chip, which is normally aluminum bonding cord in typical components. ^
Typical power component package cross-section

At present, industrial silicon carbide power modules still mostly use the packaging technology of this wire-bonded typical silicon IGBT component. They face troubles such as big high-frequency parasitical specifications, not enough heat dissipation ability, low-temperature resistance, and inadequate insulation strength, which limit using silicon carbide semiconductors. The display screen of excellent performance. In order to solve these problems and fully make use of the massive potential advantages of silicon carbide chips, many brand-new product packaging innovations and options for silicon carbide power components have actually arised in the last few years.

Silicon carbide power component bonding technique

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have actually developed from gold cord bonding in 2001 to aluminum cable (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have established from gold cables to copper cords, and the driving force is expense decrease; high-power gadgets have developed from light weight aluminum cables (strips) to Cu Clips, and the driving pressure is to enhance product efficiency. The greater the power, the greater the demands.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that utilizes a solid copper bridge soldered to solder to attach chips and pins. Compared to standard bonding packaging techniques, Cu Clip modern technology has the complying with benefits:

1. The link between the chip and the pins is made of copper sheets, which, to a specific level, changes the basic cable bonding technique in between the chip and the pins. Consequently, an one-of-a-kind package resistance worth, greater present circulation, and much better thermal conductivity can be acquired.

2. The lead pin welding area does not need to be silver-plated, which can fully conserve the expense of silver plating and inadequate silver plating.

3. The product appearance is entirely constant with typical items and is mainly used in web servers, portable computer systems, batteries/drives, graphics cards, electric motors, power products, and various other fields.

Cu Clip has 2 bonding techniques.

All copper sheet bonding approach

Both the Gate pad and the Source pad are clip-based. This bonding approach is more pricey and intricate, yet it can accomplish better Rdson and better thermal results.

( copper strip)

Copper sheet plus wire bonding approach

The source pad utilizes a Clip technique, and eviction uses a Cord method. This bonding method is somewhat less expensive than the all-copper bonding approach, conserving wafer area (suitable to really small entrance locations). The procedure is simpler than the all-copper bonding approach and can get better Rdson and better thermal impact.

Provider of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper strip roll, please feel free to contact us and send an inquiry.

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